Special Purpose Adhesive Formulation (17)

501 epoxy adhesive

Component dosage /g component dosage /g
E-51 epoxy resin 100 2-ethyl-4 methyl imidazole 4
F-76 epoxy resin 40 KH-560 coupling agent 4
Liquid nitrile rubber 25 Silver 500-600
647 # anhydride 120

Preparation and curing 647 # anhydride first heated and melted, and then weighed for preparation. The curing conditions were 3 hours at 120°C.

Use The glue is resistant to ethanol, B, engine oil, 3% NaCl, and its strength does not change after one month. Used for the bonding of conductive elements.

Anchor 401

Component dosage /g component dosage /g
A, polyester resin 1 C, silver powder 10
B. Modified TDI solution 4

Preparation and curing A, B, C three components accurately weighed and mixed. Apply glue once, dry for 10-15 minutes, superimpose and cure for 10 hours at 30°C.

Use This glue is mainly used for telecommunication, no stack electrical device bonding.

701 epoxy conductive adhesive

Component dosage /g component dosage /g
E-51 epoxy resin 100 epoxy curing agent 701 13-15
B-63 epoxy resin 10-20 reduced silver powder 250-300
Dioctyl phthalate 5-6

Preparation and curing Curing at 20°C for 4-5 hours, curing at 70-80°C for 1 hour, and curing at 120-130°C for 1.5-2 hours.

Use The glue is used for bonding aluminum and copper parts under -50-60 instead of soldering.

703 conductive adhesive

Component dosage /g component dosage /g
A, water glass C, 34% ammonia solution
B. Electrolytic silver powder (250 mesh) A: B: C=1: (1.8-2): (0.1-0.2)

Preparation and curing Curing for 2 days at room temperature or curing at 120°C for 1 hour.

Use The glue is used for metal conductive bonding.

711 conductive adhesive

Component dosage /g component dosage /g
E-51 epoxy resin 70 epoxy thinner 600 10
W-95 epoxy resin 30 2-ethyl-4 methyl imidazole 1.5
Polyvinyl butyral 7-phenylenediamine 20
Carboxy Butadiene Rubber 10 Silver 250-300

Preparation and curing Curing at 80°C for 1 hour and then at 150°C for 2-3 hours.

Use The glue is mainly used for copper and aluminum alloy bonding instead of soldering.

901 conductive adhesive

Component dosage /g component dosage /g
A, E-44 epoxy resin dissolved 100 C, silver powder 200-250
B, curing agent number A: B: C = 2: 0.15: 4.5

Prepare and cure at 120°C for 2 hours.

Use This glue is used for bonding metal parts.

DY-10 conductive adhesive

Component dosage /g component dosage /g
E-51 Epoxy Resin 100 Silver Powder 200-265
Metaxylylenediamine 15

Preparation and curing The adhesive is mainly used for the bonding of barium titanate piezoelectric crystals, ultrafine metal wires, printed circuit waveguides and carbon brushes.

J-17 conductive adhesive

Component dosage /g component dosage /g
E-51 epoxy resin 70 2 ethyl-4 methyl imidazole 3
W-95 epoxy resin 30-phenylene diamine 2
Carboxy Butadiene Rubber 15 Reduction Silver 300
Polyvinyl butyral 5 KH-560 2
Epoxy thinner 600 10

Preparation and curing Curing for 3 h at 160°C and 0.05 MPa pressure.

Purpose The adhesive is used to bond the assembled electrical instrumentation devices.

DAD-5 conductive adhesive

Component dosage /g component dosage /g
Epoxy Resin 1.1 Silver Powder 2.5-3.5
Imidazole curing agent 0.1-0.15

Preparation and curing
The components are mixed according to the formulation amount, and the mixture is stirred into a putty-like form. The surface of the adherend is chemically treated and preheated to 40-50° C. under infrared light, and the adhesive is applied and closed. Cured at 0.05-0.1 MPa, 100°C for 3 h.

Applications The adhesive can be used at temperatures up to 180°C, good electrical conductivity, and high bonding strength. It is mainly used for conductive bonding and sealing in the radio industry. It is also used as an EL light source lead and thin film circuit on the transistor core and substrate. Then.



Source: 21st Century Fine Chemicals Network

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